Whether selective conformal coating, potting applications, TCA’s and ECA’s, optical bonding or underfill - we find the right dispensing process for every application, from solder paste to a wide variety of adhesives and highly filled TCA’s.
Selection of previous projects
Apply adhesive to battery systems
Research for alternative adhesives; definition of dispense technology and check of the cured mechanical properties of the connection by means of shear strength tests.
Conformal coating of solder joints
Jetting of UV adhesive. Conformal coating of electronical components on ceramic PCB.
Potting of solder joints on a pressure sensor.
Casing encapsulation of an electromechanical switch.