Whether selective conformal coating, potting applications, TCA’s and ECA’s, optical bonding or underfill - we find the right dispensing process for every application, from solder paste to a wide variety of adhesives and highly filled TCA’s.

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Selection of previous projects

Apply adhesive to battery systems

Research for alternative adhesives; definition of dispense technology and check of the cured  mechanical properties of the connection by means of shear strength tests.

Conformal coating of solder joints

Jetting of UV adhesive. Conformal coating of electronical components on ceramic PCB.

Electronics encapsulation

Potting of solder joints on a pressure sensor.

Casing encapsulation

Casing encapsulation of an electromechanical switch.

swiss dispensing ag

Company address: swiss dispensing ag, Bärletweg 4, 2555 Brügg, Switzerland
Laboratory address: swiss dispensing ag, Bernstrasse 5, 3238 Gals, Switzerland

info@swissdispensing.ch I +41 32 372 10 80

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