top of page


Whether selective conformal coating, potting applications, TCA’s and ECA’s, optical bonding or underfill - we find the right dispensing process for every application, from solder paste to a wide variety of adhesives and highly filled TCA’s.

Electronics (3).png

Selection of previous projects

Apply adhesive to battery systems


Research for alternative adhesives; definition of dispense technology and check of the cured  mechanical properties of the connection by means of shear strength tests.

Conformal coating of solder joints


Jetting of UV adhesive. Conformal coating of electronical components on ceramic PCB.

Electronics encapsulation


Potting of solder joints on a pressure sensor.

Casing encapsulation


Casing encapsulation of an electromechanical switch.

bottom of page